

100g AMTECH NC-559-ASM-UV flux paste solder BGA
Volume : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP
packages, and assemble operations such as Flip Chip attachment to PWB
substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
Our Price
R499,00
Stock Status
In stock with our store
In stock with our store
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