Pretoria 012 567 7911 | Centurion 012 664 8903
Head Office - Pretoria
Centurion
VolumeĀ : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP
packages, and assemble operations such as Flip Chip attachment to PWB
substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
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