Brand : AMTECH
Model : RMA-223
Volume : 100g
It can be used for PCB, BGA , PGA reworking, soldering and reballing of computer and phone chips.

Excellent capacity of solder stickiness.
Excellent Anti wet Capacity .
Widely used on BGA, PGA, CSP packages and flip chip operation .
Suitable for multiple PCB reflow.
No-clean and Lead free for environmental protection.

Reviews

There are no reviews yet.

Be the first to review “AMTECH RMA-223 Solder Flux Solder Paste for BGA Reballing Rework 100g”

Your email address will not be published. Required fields are marked