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Description: 100g Kingbo RMA-218 Solder Flux Solder Paste for BGA PCB Repairing
Brand: Kingbo
Model: RMA-218
Volume: 100g
The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA, and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. A good formula for BGA reballing / balls works it can stick the balls much more.
Package included: 1 x Kingbo RMA-218 Solder Flux Solder Paste
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